General Product Information Breadboards

HSN Code : 8534

Copper : Single Side

Hole Pitch : 2.54 mm

Pad Size : 2.20mm

Hole Dia : 1.00 mm

Copper Thickness : 18 Micron

Board Thickness : 0.059 in ~ (1.5 mm)

Material : A Grade FR2 / Phenolic

Special Feature : Copper layer is laminated / lacquered